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  • Sign Assembly

    Patent: 4,817,316
    Issued: April 4, 1989
    Inventor: Robert E. Walker, Westchester, IL
    This changeable copy sign assembly is made up of several wafers, each bearing a single indicium on a relatively opaque background. The wafers and a backing strip are removably retained to a face plate of the assembly at an elongated, window-like opening, and the backing strip is composed of opaque markings for preventing the leakage of light between adjacent wafers.
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